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Quartz sieve plate

Quartz sieve plate

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More Details

1. Product Overview
Item Name: Precision-Perforated Fused Quartz Disc
Application: Optical components, microfluidic devices, laser systems, or filtration systems (customizable).

2. Key Specifications
Parameter: Value
Material: High-Purity Fused Quartz (SiO₂ ≥99.99%)
Diameter: 50.0 mm ±0.1 mm
Thickness: 3.0 mm ±0.05 mm
Number of Holes: 2000
Hole Diameter: 0.15 mm ±0.02 mm
Hole Arrangement: Uniform hexagonal/array pattern (customizable)
Surface Finish: Optical-grade polish (Ra ≤5 nm)
Flatness: ≤λ/4 @ 632.8 nm

3. Material Properties
Transmittance: >92% (200–2500 nm wavelength range)
Thermal Stability: Up to 1200°C (no structural deformation)
Chemical Resistance: Inert to acids, alkalis, and organic solvents.

4. Processing Requirements
1.Hole Precision:
Positional tolerance: ±0.02 mm (relative to design coordinates).
Perpendicularity: ≤0.5° deviation from surface normal.
Edge quality: Burr-free, laser-drilled or etched (optional).
2.Surface Quality:
Scratch-dig: 20-10 (MIL-PRF-13830B standard).
Cleanliness: Class 100 cleanroom packaging.

5. Inspection & Testing
Dimensional Verification: CMM (Coordinate Measuring Machine) for hole size/spacing.
Optical Testing: Interferometry for flatness; spectrophotometry for transmittance.
Visual Inspection: 100% check for cracks, chips, or contamination.

6. Packaging & Storage
Packaging: Anti-static, vacuum-sealed with shock-absorbent foam.
Storage: Dry environment (<40% RH), 10–30°C.

7. Notes
Custom configurations (hole patterns, coatings, or additional markings) available upon request.
Compliance certificates (RoHS, ISO 9001) provided with bulk orders.
 

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